U.S. federal trademark · Serial No. 85046054 · Reg. No. 4060921
Engineering and design services in the field of thermal extrusions and heat sinks for printed circuit boards, namely, high density extrusions, bonded heat sinks, stack and swage fins, folded fin, DC/DC converter, printed circuit board levels, BGA/PGA heat sinks for computers, microprocessor heat sinks, and cold plates and conduction-cooled heat frames for printed circuit boards
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.