U.S. federal trademark · Serial No. 76087708 · Reg. No. 2586317
compositions of phenolic epoxy and other resins which may or may not contain electrostatic dissipative materials combined with glass cloth and cured under heat and pressure to form a themoset composite which is then fabricated into pallets for carrying and protecting printed circuit boards through the reflow solder process and the wave solder process
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.