Solder pallet materials made from compositions of phenolic epoxy and other resins which may or may not contain electrostatic dissipative materials combined with glass cloth and cured under heat and pressure to form a thermoset composite Such materials are fabricated into pallets for carrying printed circuit boards through the printed circuit board manufacturing processes of assembly, soldering and/or reflow

'and/or':58 'assembl':56 'board':47,52 'carri':44 'circuit':46,51 'cloth':25 'combin':22 'composit':6,36 'contain':18 'cure':27 'dissip':20 'electrostat':19 'epoxi':9 'fabric':40 'form':33 'glass':24 'heat':29 'made':4 'manufactur':53 'materi':3,21,38 'may':14,16 'pallet':2,42 'phenol':8 'pressur':31 'print':45,50 'process':54 'reflow':59 'resin':12 'solder':1,57 'thermoset':35

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