U.S. federal trademark · Serial No. 99643832
Manufacturing services for others in the field of micro-fabrication, wafer-level processing, thin-film deposition, micromachining, photonic device fabrication, co-packaged optics assembly, and encapsulation of electronic, photonic, micro-technological and ultrasonic components; prototype manufacturing of sensors, capacitive micromachined ultrasonic transducers (CMUTs), photonic modules, co-packaged optical components and micro-modules for others.
Engineering services; design and development of electronic, photonic, micro-technological and ultrasonic devices and systems; design and development of photonic platforms, photonic integrated circuits and co-packaged optical modules; scientific and technological research; technical consultancy in the field of micro-fabrication, photonics, materials science, device architectures and component integration; testing, analysis and evaluation of the goods of others for the purpose of certification; research and development of new products; hosting and providing temporary use of non-downloadable software, namely SaaS and PaaS, for the design, modelling, simulation, data analysis and testing of electronic, photonic, micro-technological and ultrasonic devices.
Scientific, research and industrial measuring and monitoring apparatus; electronic sensors and detectors; capacitive micromachined ultrasonic transducers (CMUTs) and arrays; ultrasonic transducers; photonic devices and components; integrated photonic circuits; co-packaged optical modules and optical transceiver components; micro-electromechanical systems (MEMS) and parts thereof; integrated circuits, semiconductor chips and wafers; thin-film, micro-fabricated and photonic components; downloadable software for the design, modelling, simulation, configuration and testing of electronic, photonic, micro-technological and ultrasonic devices.
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.