U.S. federal trademark · Serial No. 99643836
Scientific, research and industrial measuring and monitoring apparatus for microsystems, semiconductor equipment, photonics, membranes, and thin film fields of use; electronic sensors and detectors, namely, optical sensors, ultrasonic sensors, position sensors, and industrial calibration sensors; capacitive micromachined ultrasonic transducers (CMUTs) and arrays; ultrasonic transducers; photonic devices and components, namely photonic microchips; integrated photonic circuits; co-packaged optical modules and optical transceiver components, namely, optical tables, optical shutters, optical reflectors, optical readers, optical sensors, optical receivers, optical semiconductors, optical lenses, optical semiconductor amplifiers, transceivers and optical transceivers; micro-electromechanical systems (MEMS), namely, sensors, photonic microchips, semiconductors and microchips, micro-mirrors, scanners, DLP arrays, MEMS timing devices, micro-fluidic chips, lab-on-a-chip; integrated circuits, semiconductor chips and wafers; thin-film, micro-fabricated and photonic components, namely photonic sensors, lidars, optical switches, micromirrors, fibre couples, gratings, microlenses; downloadable software for the design, modelling, simulation, configuration and testing of electronic, photonic, micro-technological and ultrasonic devices.
Engineering services; product and process design and development of electronic, photonic, micro and nano-technological and ultrasonic devices and systems; design and development of photonic platforms, photonic integrated circuits and systems, and co-packaged optical modules for microsystems, semiconductor equipment, photonics, membranes, etching, coating, and thin film fields of use; scientific and technological research; scientific and technological research, namely, research and design in the field of hardware for use in the semiconductor equipment, photonics, membranes, and thin film fields of use; technical consultancy in the field of micro-fabrication, photonics, materials science, device architectures and component integration; testing, analysis and evaluation of the goods of others for the purpose of certification; research and development of new products; hosting and providing temporary use of non-downloadable software, namely SaaS and PaaS, for the design, modelling, simulation, data analysis and testing of electronic, photonic, micro-technological and ultrasonic devices.
Manufacturing services for others in the field of micro-fabrication, wafer-level processing, thin-film deposition, micromachining, photonic device fabrication, co-packaged optics assembly, and encapsulation of electronic, photonic, micro-technological and ultrasonic components; prototype manufacturing of sensors, capacitive micromachined ultrasonic transducers (CMUTs), photonic modules, co-packaged optical components and micro-modules for others
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.