U.S. federal trademark · Serial No. 50097148
Dispenses and assembly equipment for the semiconductor, advanced packaging and microelectronics industry; Die bonders used in manufacturing electronic components; Machines for the assembly of semiconductor components; Vacuum reflow ovens
Downloadable software for analyzing, inspection, testing and assembly of semi-conductors, integrated circuits and chips; Apparatus for analyzing, inspection, testing and assembly of semi-conductors, integrated circuits and chips, namely, electro-optical instruments for use in inspection and measurement of industrial components
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.