Trademark Search / XSP - TRANSFORMABLE SUBTRACTIVE PACKAGE

XSP - TRANSFORMABLE SUBTRACTIVE PACKAGE

○ Dead · Abandoned

U.S. federal trademark · Serial No. 78120176

Mark

Status

Abandoned

Serial Number

78120176

Filing Date

April 8, 2002

Class(es)

Class 035

Owners

MTBSolutions, Inc.

03 · San Jose, CA, US

Amitec Ltd.

03 · Migdal Haemek, IL

ASE Electronics (M) Sdn. Bhd.

03 · Penang, MY

Goods & Services

high performance semiconductor packaging technology integrating silicon die and package to create improved component performance, speed and reduced form factor

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.